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Board to Board

A collection of 11 posts

Routing 100-Ohm Differential Pairs on High-Speed FPCs

Routing 100-Ohm Differential Pairs on High-Speed FPCs

Cross-hatched ground planes preserve FPC flexibility while providing tight 100-ohm differential impedance matching for high-speed links.

Floating Interconnects Evaluated: FX30B vs. SlimStack vs. Aorora

Floating Connectors

Floating Interconnects Evaluated: FX30B vs. SlimStack vs. Aorora

We break down the floating connector landscape, comparing Amphenol Aorora with Hirose's FX30B and Molex's SlimStack.

Shifting Tolerances: The Engineering Behind Floating Board-to-Board Systems

Floating Connectors

Shifting Tolerances: The Engineering Behind Floating Board-to-Board Systems

Tolerance stack-up can ruin your day. Discover how floating board-to-board connectors absorb multi-axis movement to protect surface-mount pads.

The Engineering Basics of Selecting Low-Profile B2B Connector Solutions for Compact Digital Hardware

An introductory guide to choosing a general-purpose b2b connector for internal component stacking, focusing on pitch, contact reliability, and manufacturing choices.

Industrial Interconnect Design Choices: Evaluating Crimp vs Solder Methods for Wire-to-Board and Wire-to-Wire Applications

crimp vs solder

Industrial Interconnect Design Choices: Evaluating Crimp vs Solder Methods for Wire-to-Board and Wire-to-Wire Applications

An analytical breakdown of crimp vs solder wire termination methodologies, evaluating mechanical fatigue resistance, electrical consistency, and deployment scalability.

Advancements in High Speed Board to Board Connector Design for Next-Generation Processing Architecture

High Speed Connector

Advancements in High Speed Board to Board Connector Design for Next-Generation Processing Architecture

Explore how high speed board to board connector interfaces handle multigigabit data streams. Learn about spatial density, signal integrity modeling, and grounding architectures.

The Miniaturization Crunch: High-Density Board-to-Board and Mezzanine Connectors Take Center Stage

Mezzanine Connector

The Miniaturization Crunch: High-Density Board-to-Board and Mezzanine Connectors Take Center Stage

With over half of all PCB designers prioritizing space-saving layouts, ultra-fine pitch mezzanine connectors are becoming essential structural tools.

Taming Insertion Loss: Prioritizing Signal Integrity at High Frequencies Within Compact Footprints

Signal Integrity

Taming Insertion Loss: Prioritizing Signal Integrity at High Frequencies Within Compact Footprints

As operating frequencies climb across AI, data center, and automotive applications, keeping signal reflections low inside small enclosures is a critical discipline.

Bypassing Motherboard Copper Traces With Cabled PCIe Gen 6 Over-the-Board Interconnects

Bypassing Motherboard Copper Traces With Cabled PCIe Gen 6 Over-the-Board Interconnects

At 64 GT/s, traditional motherboard copper traces cause unacceptable signal loss. Server architects are moving high-speed data completely over the board.

Powering the AI Boom: A Deep Dive into Connectors Inside GPU Servers

Powering the AI Boom: A Deep Dive into Connectors Inside GPU Servers

As AI workloads skyrocket, GPU servers require unprecedented levels of power and data throughput. This deep dive explores the specialized, high-performance connectors architecture—from PCIe Gen 6 to high-current busbars—that keep next-gen AI clusters running smoothly without bottlenecking.

High-Density Board-to-Board Interconnects: Mezzanine Design

High-Density Board-to-Board Interconnects: Mezzanine Design

Mezzanine connectors allow for modular PCB stacking. We analyze the "stack height" and "pin density" requirements for modern high-speed compute modules and data center hardware.